Senior Electronic Board Layout Designer, Lausanne

Overview Expleo

is a global engineering, technology, and consulting partner helping businesses innovate, transform, and deliver high‑quality products and solutions. With expertise spanning aerospace, automotive, transportation, telecommunications, financial services, and life sciences, we support clients in solving complex engineering challenges while accelerating innovation. Our teams combine deep technical knowledge with a hands‑on mindset, working collaboratively to drive measurable impact and operational excellence.

Expleo is seeking a

Senior Electronic Board Layout Designe r

to strengthen our product development activities for advanced communication and embedded systems. You’ll own the full

PCB layout

cycle for complex, high‑reliability multi‑layer boards, translating

electrical/RF/mechanical requirements

into production‑ready designs, and releasing complete manufacturing packages in close collaboration with cross‑functional teams in Lausanne.

Responsibilities

End‑to‑end

PCB layout

ownership: from requirements analysis and constraint definition to placement, routing, checks, documentation and manufacturing release.

Design complex,

multi‑layer PCBs

(typically 10–20+ layers) including high‑speed interfaces (e.g., Ethernet, DDR), FPGA‑centric subsystems, sensitive analog/mixed‑signal, power distribution and where applicable RF sections.

Apply controlled‑impedance routing, differential pairs, return‑path integrity, length matching, crosstalk mitigation and decoupling strategies to meet SI/PI and EMC targets.

Work hands‑on in Altium Designer/Altium 365 (or equivalent enterprise ECAD) using hierarchical design, rooms/replication, templates, and robust library management practices.

Generate complete manufacturing outputs (e.g., Gerber/ODB++, stack‑ups, drill, fab&assembly drawings, IPC/assembly notes, pick‑and‑place, stencil, coupons), and release through PLM (e.g., Agile/Oracle or equivalent).

Drive DFM/DFA/DFT with EMS and fabrication partners; iterate for yield, reliability, test coverage, and cost.

Collaborate daily with Hardware/Electrical, RF, Mechanical (SolidWorks), and Embedded teams; participate in design reviews, challenge constraints, and propose layout‑driven improvements.

Support prototype builds (FAI), root‑cause investigations and ECN/PCN updates; enact component/library changes and maintain traceable documentation.

Where appropriate, perform or interpret SI/PI/EMI analyses (e.g., with SIwave/HyperLynx/Sigrity) and close actions with the HW/RF teams.

Uphold configuration control, versioning and compliance to applicable standards (IPC class, safety/EMC design rules, customer/aerospace/medical/automotive requirements).

Qualifications

10+ years of professional experience

designing

complex, multi‑layer PCBs (12+ layers)

in highly regulated or demanding environments such as aerospace, medical, automotive, or industrial electronics.

Expert proficiency with

Altium Designer/Altium 365 , including hierarchical design, room‑based replication, and advanced layout workflows.

Experience working with high‑speed digital interfaces, FPGA placement and routing, mixed‑signal constraints, and low‑noise board design.

Strong understanding of

Design‑for‑Manufacturing ,

Design‑for‑Assembly , and

Design‑for‑Testing/Maintenance

principles.

Solid library management experience and knowledge of PCB stack‑ups, controlled impedance routing, and signal integrity fundamentals.

Clear, concise communication skills in English (written and verbal).

Ability to work at least

3 days per week onsite

in Lausanne

Desired skills

Familiarity with simulation tools such as

Ansys SIwave

and

LTspice .

Experience collaborating with RF engineers working on 20–30 GHz systems.

Prior work with embedded software or programmable logic engineers.

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